ROBIN OVERING | ENGINEER

Problem

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• Design packaging to be used multiple times to ship 250 delicate PCBs.

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Challenge

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• Create packaging using low-cost materials but ensure that the packaging can be reused multiple times.

• Ensure delicate piezos do not break during transport.

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Solution

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• Secure PCBs with ESD safe foam pads on the top and bottom covers.

• Shape PCB openings such that delicate piezos cannot be bumped.

• Isolate PCBs such that a broken piezo cannot damage another.

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